| Demand for Internet services, need for improved copper line conditions, need to extend reach of copper lines, and increases in network traffic are major switch fabric market driving forces. Switch fabric, crosspoint switch, and backplane transceiver markets impact the entire network architecture for communications. These markets are looked as one entity because they address the same issue, how to move packets across the backplane. Two significant market shifts are occurring. The old circuit switch architecture depended on one clock in Denver to create simultaneity for all the logic in all the proprietary circuit switch hardware. With the Internet cloud architecture, the one clock is gone and all the switches that move packets have different clocks. The shift in architecture puts more stress on the components that create switching capability in the network. These units have to operate at higher speeds and with more flexibility to handle the traffic that is being generated by the Internet. Combined voice, video, and data traffic is moving across the same switches at the same time, creating demand for new types of switch IC.
The transfer of information from the line card or motherboard to the backplane is moving from a parallel to serial architecture. This in turn gives rise to demand for new types of IC. Blade servers are replacing to old circuit switches and the proprietary PBX hardware. Clustered blade servers with carrier grade Linux operating systems create computer industry hardware that can be used with proprietary software. Switch fabric, crosspoint switch, and backplane transceiver markets at $101.2 million in 2003 are expected to reach $579.6 million by 2009. Market growth is expected to be spurred by demand for storage and video capable networks. Higher speeds complement existing infrastructure. Gigabit Ethernet IC markets will drive demand for high-speed communications. Asynchronous IC communications capability provided by crosspoint switches permits design flexibility. Different protocols are supported. Switch fabric markets in dollars at $50.7 million in 2003 are expected to reach $235.6 million by 2009.
Table of Contents
SWITCH FABRIC EXECUTIVE SUMMARY SWITCH FABRIC EXECUTIVE SUMMARY ES-1
Switch Fabric Market Driving Forces ES-1
Synchronous Switch Fabrics ES-2
Switch Fabrics Receive Data From A Line Card ES-3
Switch Fabric Market Shares ES-4
Switch Fabric Markets ES-6 SWITCH FABRIC MARKET DYNAMICS AND MARKET DESCRIPTION 1. SWITCH FABRIC MARKET DYNAMICS AND MARKET DESCRIPTION 1-1
1.1 Switch Fabric Market Conditions 1-1
1.1.1 Broadband Connectivity In The Access Network 1-2
1.1.2 Substantial Restructuring Efforts 1-3
1.2 Market-Driven Organizations 1-4
1.2.1 Key Business Drivers 1-4
1.3 Telecommunications in the Context of the Global Economy 1-7
1.3.1 Economic Market Situation 1-10
1.3.2 Telecommunications Market Situation 1-12
1.3.3 Telecom Markets 1-13
1.3.4 Telecommunications Industry Shifts 1-14
1.4 Point Of Presence 1-17
1.5 Carrier Requirements 1-19
1.5.1 Business Challenges 1-20
1.5.2 Excess Capacity 1-22
1.5.3 Reducing Operating Expenditures 1-23
1.6 Technology Challenges 1-25
1.6.1 Ethernet in the First Mile 1-26
1.6.2 Evolution of the First / Last Mile 1-27
1.7 Combined Voice And Data 1-29
1.8 Reduced Complexity 1-29
1.8.1 Broadband Implementation By Incumbent Service Providers 1-29
1.9 Integrated Multimedia Services 1-30
1.9.1 Integrated Video Services 1-31
1.9.2 10 Gigabit Ethernet Applications 1-31
1.10 Switch Fabric Switching Architecture 1-34
1.10.1 Multi-Service Chip Shrinks Equipment From Size Of Refrigerator To Size Of Pizza Box 1-35
1.10.2 Switch Fabric Chips OEM Market Thrust 1-36
1.10.3 Switch Fabric Building Blocks In Telecommunication Systems 1-37
1.10.4 Packet Switch Chips 1-37
1.10.5 A Typical Switch 1-38 SWITCH FABRIC MARKET SHARES AND MARKET FORECASTS 2. SWITCH FABRIC MARKET SHARES AND MARKET FORECASTS 2-1
2.1 Switch Fabric Market Driving Forces 2-1
2.1.1 Synchronous Switch Fabrics 2-2
2.1.2 Switch Fabrics Receive Data From A Line Card 2-3
2.1.3 PHY Chips 2-4
2.2 Switch Fabric Market Shares 2-5
ERROR MSG 2.2.1 Worldwide Switch Fabric Market Shares, Dollars, 2003 2-6
2.2.2 Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Shares, 2-8
2.3 Switch Fabric Markets 2-13
2.4 Worldwide Switch Fabric, Crosspoint Switch, and Backplane Transceiver Market Forecasts 2-16
2.4.1 Regional Market Analysis Crosspoint Switch, Switch Fabric, and Backplane Transceiver 2-23
2.4.2 Crosspoint Switch Market Forecast Growth Depends on Economy 2-25
2.4.3 Emerging Growth Opportunities 2-25
2.5 Voice And Data Services Market 2-26
2.6 Ethernet IC Market Forecasts 2-27
2.6.1 Ethernet Chips 2-28
2.7 Internet 2-29
2.7.1 Improve Capital Efficiency 2-29
2.7.2 Reliance on IP 2-29 SWITCH FABRIC PRODUCT DESCRIPTION 3. SWITCH FABRIC PRODUCT DESCRIPTION 3-1
3.1 Switch Fabrics 3-1
3.1.1 Enterprise Systems 3-1
3.1.2 Carrier Systems 3-2
3.2 Applied Micro Circuits (AMCC) 3-2
3.2.1 Applied Micro Circuit Corporation (AMCC) / IBM 3-2
3.2.2 Applied Micro Circuit Corporation (AMCC) PowerPRS 16g/C192 3-4
3.3 Agere Systems 3-7
3.3.1 Agere Systems Switching Chip 3-7
3.3.2 Agere Low Cost Switching Fabric 3-9
3.3.3 Agere LSP2916 16-Channel, High-Voltage Driver 3-11
3.3.4 Processing, Aggregation and Switching Devices 3-12
3.4 Vitesse Switch Fabric Technology 3-12
3.4.1 Vitesse’s London™ Family of Gigabit Switch ICs 3-13
3.4.2 Vitesse Semiconductor Gigabit Ethernet Switches, Elstree™ (8-port) and Stansted™ 3-13
3.4.3 Vitesse Elstree and Stansted Features and Pricing 3-14
ERROR MSG 3.4.4 Vitesse Semiconductor TimeStream family, the VSC9195 3-16
3.4.5 Vitesse TeraStream 3-18
3.4.6 TeraStream Efficient Bandwidth Utilization 3-23
3.4.7 Vitesse TeraStream ® Chip Set (VSC871 & VSC881) 160 Gb/s Intelligent Switch Fabric 3-24
3.4.8 Vitesse Semiconductor TeraStream chipset 3-25
3.4.9 Vitesse GigaStream ® Chip Set (VSC872 & VSC882) 80 Gb/s Intelligent Switch Fabric Applications 3-29
3.4.10 Vitesse GigaStream High Availability 3-31
3.4.11 Vitesse Semiconductor Enterprise Ethernet-Switching 3-33
3.4.12 Vitesse Integrated Layer 3 GbE Switch / Router ICs 3-35
3.5 Broadcom 3-36
3.5.1 Broadcom BCM83xx chipset 3-36
3.5.2 Broadcom ROBOswitch 3-37
3.5.3 Broadcom StrataSwitch® II Products 3-37
3.5.4 Broadcom Integrated Carrier-Class Switch Fabric Chipset 3-38
3.6 Dune Networks 3-39
3.7 Erlang Technology 3-39
3.8 Internet Machines 3-41
3.9 PetaSwitch Solutions 3-41
3.10 Sandburst 3-42
3.11 Tau Networks 3-44
3.11.1 Tau Switch Fabric 3-44
3.12 TeraChip 3-45
3.13 TeraCross 3-45
3.14 Zagros Networks 3-47
3.15 ZettaCom 3-47
3.16 Marvel Semiconductor Enterprise Ethernet-Switching 3-48
3.16.1 Prestera Switching Architecture 3-49
3.16.2 Marvel GalNet®-2 3-51
3.16.3 Marvel GalNet®-3 3-53
3.16.4 Marvell® 24-port Gigabit Ethernet switch 3-53
3.17 Link Street Switches 3-54
3.17.1 Link StreetTM SOHO Multi-Port Integrated Switches 3-55
3.18 Velio Storage Fabric 3-56
3.19 Tyco Electronics 3-56
3.20 ZSF Terabit Switch Fabric 3-57
3.20.1 ZSF TQ8004 3-57
3.21 Triquint Semiconductor 3-58
3.21.1 Triquint Semiconductor High-Performance pHEMT Process 3-58
3.21.2 TriQuint TQ8004 3-61 SWITCH FABRIC TECHNOLOGY 4. SWITCH FABRIC TECHNOLOGY 4-1
4.1 Topologies For Backplane Architecture 4-1
4.1.1 Primary Traffic Patterns In A Backplane Environment 4-1
4.1.2 Multi-Point Architecture And Point-To-Point Architectures 4-2
4.1.3 Point-To-Point Switched Backplane 4-4
4.1.4 Star Topology 4-5
4.1.5 Out-Of-Band And In-Band Switch Control 4-6
4.1.6 Mesh Backplane 4-6
4.1.7 Point-To-Point 4-7
4.1.8 Multi-Point Backplane 4-8
4.1.9 Switching From Multi-Point Architecture 4-10
4.2 Switch Architectures 4-11
4.2.1 Ideal Switch 4-11
4.2.2 Switch With Virtual Output Queues On The Ingress Side 4-13
4.2.3 Switch With Shared Memory in Switch Fabric 4-15
4.2.4 Buffered Crossbar Switch Architecture 4-16
4.3 Development of 10 Gbit/s Ethernet 4-19
4.3.1 Cisco Control Plane Operations 4-20
4.3.2 Cisco 10 GigE 4-20
4.3.3 Cisco Two-Port 10-Gbit/s Solutions 4-21
4.3.4 Cisco Metro Ethernet Services 4-22
4.3.5 Mitel Analog Switch Matrix Functional Description 4-23
4.3.6 Address Decode 4-24
4.3.7 Foundry Networks 4-24
4.3.8 Enterprise Applications 4-25
4.3.9 Access Routing In The Metro Network 4-25
4.3.10 Chiaro Router Optical Phased Array Switching 4-26
4.3.11 Pluris 4-27
4.4 Intel Advanced Switching For PCI Express 4-27
4.4.1 Intel PCI Bridges 4-35
4.4.2 Intel Advanced Switching Interconnect SIG 4-35
4.5 Advanced Switching Interconnect (ASI) Backplane Link 4-37
4.5.1 I/O Interconnect Technology Analysis 4-38
4.5.2 PCI-SIG Ratified PCI Express Architecture 4-40
4.5.3 AS Spec Vs HyperTransport and RapidIO 4-47
4.5.4 RapidIO Link 4-48
4.5.5 HyperTransport 4-49
4.6 Scheduling, Quality of Service (QoS), and Arbitration 4-51
five star hotel in Taastrup 4.6.1 Scheduling 4-51
4.6.2 Arbitration 4-52
4.6.3 Quality of Service (QoS) 4-52
4.6.4 Frames 4-53
4.7 Redundancy 4-54
4.7.1 Passive Redundancy (1:1, N:1) 4-55
4.7.2 Load-Sharing Redundancy (N+1, N-1, N+N) 4-56
4.7.3 Active Redundancy (1+1) 4-56 SWITCH FABRIC / CROSSPOINT SWITCH / BACKPLANE TRANSCEIVER COMPANY PROFILES 5. SWITCH FABRIC / CROSSPOINT SWITCH, BACKPLANE TRANSCEIVER COMPANY PROFILES 5-1
5.1 Accelerant Networks 5-1
5.1.1 Unlocking Copper 5-2
5.1.2 CMOS technology 5-2
5.1.3 Upgrading Installed Systems 5-2
5.1.4 Enabling Low-Cost Higher Port Density Systems 5-3
5.2 Agere 5-3
5.2.1 Agere Systems And Accelerant Networks 5-4
5.2.2 Boosting Bandwidth In Existing Backplanes 5-6
5.2.3 Agere Access Portfolio 5-7
5.2.4 Agere Systems Revenue 5-8
5.2.5 Agere Results by Segment 5-8
5.2.6 Agere Strategy 5-9
5.3 Analog Devices 5-10
5.3.1 Analog Devices Products 5-11
5.3.2 Analog IC Technology Foundation Of The Business 5-12
5.3.3 Analog Devices MEMS 5-13
5.3.4 Analog Devices DSP Products 5-14
5.3.5 Analog Devices Mixed-Signal Products 5-14
5.3.6 Analog Devices Customers 5-15
5.3.7 Analog Devices Revenue 5-15
5.4 Applied Micro Circuits Corporation AMCC 5-17
5.4.1 AMCC Positioning 5-18
5.4.2 AMCC Customers 5-18
5.4.3 Applied Micro Circuits Corporation (AMCC) Revenue 5-22
5.4.4 Merger With JNI Corporation 5-23
5.4.5 AMCC Acquires IBM PRS - 5-23
5.5 Aeluros 5-25
5.5.1 Aeluros Privately Held Company 5-25
5.5.2 Aeluros High-Bandwidth Communications IC Technology 5-25
5.5.3 Bobcat Evaluation Board 5-27
5.6 Broadcom 5-27
5.6.1 Broadcom Net Revenue 5-28
5.6.2 Broadcom Products 5-29
5.7 Conexant Systems 5-31
5.7.1 Conexant Systems Revenue 5-31
5.7.2 Conexant Systems / Skyworks Financing Agreements Restructuring 5-32
5.7.3 Broadband Communications 5-32
5.8 Dune Networks 5-33
5.9 Erlang Technology 5-33
5.9.1 Erlang Technology 5-34
5.10 Exar 5-35
5.10.1 Exar Strategy 5-36
5.10.2 Exar Single-Channel UART 5-36
5.11 Fairchild Semiconductor 5-37
5.12 Infineon Technologies 5-38
5.12.1 Infineon Technologies Revenues 5-39
5.12.2 Infineon Technologies Fourth quarter 2003 results 5-41
5.12.3 Infineon Technologies DRAM Antitrust Investigations 5-41
5.12.4 Infineon Technologies Segment results 5-43
5.12.5 Infineon Technologies Regional Sales Development 5-44
5.13 Intel 5-44
5.13.1 Intel Architecture 5-46
5.13.2 Intel Corporation Revenue 5-47
5.13.3 Intel Net Revenue Segment Information 5-47
5.14 Marvel Technology 5-48
5.14.1 Marvel Technology Strategy 5-50
5.14.2 Marvel Technology to Leverage Technology for Broadband Communications
Applications 5-51
5.14.3 Marvel Technology Storage Market Applications 5-52
5.14.4 Marvel Technology Target Customers 5-53
5.14.5 Marvel Technology Revenue 5-54
Hoteles Hamburgo 5.15 Maxim Integrated Products 5-55
5.15.1 Maxim Integrated Products Revenues 5-55
5.16 Mindspeed Technologies 5-57
5.16.1 Crosspoint Switch Product Revenue 5-60
5.17 National Semiconductor 5-63
5.17.1 National Semiconductor Revenue 5-66
5.17.2 National Semiconductor Products 5-67
5.18 ON Semiconductor 5-68
5.18.1 ON Semiconductor Revenue 5-69
5.19 Teradyne 5-69
5.19.1 Teradyne Connection Systems 5-70
5.19.2 Teradyne Revenue 5-71
5.19.3 Teradyne Operating Segments 5-71
5.20 TriQuint Semiconductor 5-74
5.21 Vitesse Semiconductor 5-75
5.21.1 Comprehensive Product Portfolio 5-75
5.21.2 Vitesse Revenue 5-78
5.21.3 Cost Reduction Measures 5-80
5.21.4 Vitesse 2003 Positioning 5-80
5.21.5 Sold Line Of Optical Module Products To Avanex 5-84
5.21.6 Vitesse / Multilink 5-84
List of Tables and Figures SWITCH FABRIC EXECUTIVE SUMMARY Table ES-1 ES-2
Switch Fabric Market Driving Forces
Figure ES-2 ES-5
Worldwide Switch Fabric Market Shares, Dollar, 2003
Figure ES-3 ES-6
Worldwide Switch Fabric Market Shares, Dollars, 2004-2009 SWITCH FABRIC MARKET DYNAMICS AND MARKET DESCRIPTION Table 1-1 1-5
Key Swtich Fabric And Crosspoint Switch Business Drivers
Table 1-2 1-6
Key Switch Fabric And Crosspoint Switch Strategic Initiatives
Table 1-3 1-9
Network Hardware Requirements
Table 1-4 1-15
Telecommunications Industry Shifts
Table 1-5 1-18
Significant Technological And Architectural Advances
Table 1-6 1-28
Market Environment Driving Increased Use of Blade Servers
Table 1-7 1-32
Typical 10 Gigabit Ethernet Applications
Table 1-8 1-33
10 Gigabit Ethernet Benefits
Table 1-9 1-39
Switch Chipset Key Functions SWITCH FABRIC MARKET SHARES AND MARKET FORECASTS Table 2-1 2-2
Switch Fabric Market Driving Forces
Table 2-2 2-5
Switch Fabric Vendors
Figure 2-3 2-7
Worldwide Switch Fabric Market Shares, Dollar, 2003
Table 2-4 2-8
Switch Fabric Integrated Circuits
Table 2- 5 2-9
Switch Fabric Uses
Figure 2-6 2-10
Worldwide Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Shares, Dollars, 2003
Table 2-7 2-11
Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Shares Worldwide, Dollars, 2003
Figure 2-8 2-14
Worldwide Switch Fabric Market Forecasts, Units, 2004-2009
Figure 2-9 2-15
Worldwide Switch Fabric Market Forecasts, Dollars, 2004-2009
Table 2-10 2-16
Switch Fabric Market Shipment Analysis, Worldwide, units and Dollars, 2004-2009
Figure 2-11 2-18
Worldwide Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Forecasts, Dollars, 2004-2009
Figure 2-12 2-19
Worldwide Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Segments, Dollars, 2003
Figure 2-13 2-20
Worldwide Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Segments, Dollars, 2009
Table 2-14 2-21
Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Shipment Segment Analysis, Worldwide, Percent, 2004-2009
Table 2-15 2-22
Crosspoint Switch, Switch Fabric, and Backplane Transceiver Market Shipment Segment Analysis, Worldwide, Dollars, 2004-2009
Figure 2-16 2-23
Worldwide Crosspoint Switch, Switch Fabric, and Backplane Transceiver Regional Market Analysis, Dollars, 2003
Table 2-17 2-24
Crosspoint Switch, Switch Fabric, and Backplane Transceiver Regional Market Analysis, Dollars, 2003 SWITCH FABRIC PRODUCT DESCRIPTION Table 3-1 3-3
Applied Micro Circuit Corporation (AMCC) PowerPRS Product Family
Table 3-2 3-6
Applied Micro Circuit Corporation (AMCC) Feature Comparison Table
Table 3-3 3-11
Agere LSP2916 Features
Table 3-4 3-15
Network Features Of Vitesse Elstree and Stansted
Table 3-5 3-19
Vitesse TeraStream Intelligent Switch Fabric Features
Table 3-6 3-21
Vitesse TeraStream Intelligent Switch Fabric Algorithms
Table 3-7 3-22
Vitesse TeraStream Products
Table 3-8 3-24
Vitesse TeraStream ® Chip Set 160 Gb/s Intelligent Switch Fabric Functions
Table 3-9 3-26
Vitesse Semiconductor Switch IC Solutions
Table 3-10 3-27
Vitesse range of Channels and Speeds Supported
Table 3-11 3-28
Varying Uses for Vitesse Chipsets
Table 3-12 3-29
Vitesse GigaStream Applications
Table 3-13 3-31
Vitesse GigaStream High Availability Features
Table 3-14 3-50
Prestera-MX High-Density Gigabit Solution Device Target Markets
Table 3-15 3-60
TriQuint Preliminary Process Features
Table 3-16 3-61
TQ8004 Features SWITCH FABRIC TECHNOLOGY Table 4-1 4-2
Primary Traffic Patterns In A Backplane Environment
Table 4-2 4-2
Primary Traffic Variables In A Backplane Environment
Table 4-3 4-5
Star Topology
Table 4-4 4-7
Mesh Topology
Table 4-5 4-9
Multipoint Topology
Figure 4-6 4-12
Switch Architecture
Figure 4-7 4-14
Switch With Virtual Output Queues On The Ingress Side
Figure 4-8 4-15
Shared Memory in Switch Fabric
Figure 4-9 4-17
Buffered Crossbar Switch Architecture
Figure 4-10 4-18
Arbitrated Crossbar Crosspoint Switching
Table 4-11 4-28
Applications For ASI -- SIG
Table 4-12 4-29
Advanced Switching Target Fabrics
Table 4-13 4-30
PCI Express Target Fabrics
Table 4-14 4-31
Selected Companies Supporting PCI Express and Advanced Switching PCI Express
Table 4-15 4-34
Intel Advanced Switching For PCI Express Features
Table 4-16 4-36
Intel Advanced Switching Interconnect SIG Features
Table 4-17 4-39
I/O Interconnect Technology Choices
Table 4-18 4-39
Criteria For Interconnect Technologies
Table 4-19 4-41
Technical Requirements of Interconnect For Emerging Environment
Table 4-20 4-44
Business Requirements Of Interconnect For Emerging Environment
Table 4-21 4-46
PCI Express Specification
Table 4-22 4-48
Selected Vendors Backing RapidIO
Table 4-23 4-50
Selected Vendors Backing HyperTransport
Table 4-24 4-52
Swithch Fabric Scheduling Algorithms
ERROR MSG Table 4-25 4-55
Switch Chipset Redundancy SWITCH FABRIC / CROSSPOINT SWITCH / BACKPLANE TRANSCEIVER COMPANY PROFILES Table 5-1 5-19
AMCC Strategy
Table 5-2 5-20
Products In Which AMCC Semiconductor Are Used
Table 5-3 5-21
AMCC Complete Silicon IC Solutions
Table 5-4 5-24
AMCC IBM PRS Product Line
Table 5-5 5-57
Mindspeed Technologies Products
Table 5-6 5-58
Mindspeed Technologies Target Markets
Table 5-7 5-59
Where Mindspeed Products Are Used
Table 5-8 5-64
National Semiconductor Product Areas
Table 5-9 5-65
National Semiconductor Target Markets
Table 5-10 5-68
ON Semiconductor Functional Categories
Table 5-11 5-69
Teradyne Automatic Test Equipment Products Functions
Table 5-12 5-70
Teradyne Interconnection Systems Products And Services
Table 5-13 5-71
Teradyne Principal Operating Segments
Table 5-14 5-76
Vitesse Participation In Technology Organizations
Table 5-15 5-78
Vitesse Feature Sets
Table 5-16 5-81
Vitesse 2003 Positioning
Table 5-17 5-83
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